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Computers
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R/flex® Flexible Circuit Materials
provide interconnections that withstand repeated flexing and allow smaller package sizes for data storage, notebooks, desktops, and peripherals.
R/flex® Photoimageable Covercoats
help achieve the ultra-fine patterns needed for today's high density flexible printed circuits.
R/flex® 3000 Liquid Crystalline Polymers
enable the next generation of high speed chip packages.
SSLAM Flexible Circuit Laminates
support the read-write head suspensions in advanced hard disk drives, personal digital video recording equipment, game stations, information appliances and digital cameras.
INDUFLEX® Laminates
provide electromagnetic shielding of datacom and Local Area Network (LAN) cables.
Power Distribution Systems
distribute power in base stations for mobile communications and other telephone switching systems.
DUREL® Electroluminescent Lamps, Drivers and Phosphors
provide attractive illumination of keypads and displays in handheld computing devices.
BISCO® Silicone Materials
form the basis for spacers, seals and shock absorbing parts while also providing high temperature protection.
PORON® Industrial Urethane Foams
form the basis for sealing and shock absorbing components that help protect portable equipment.