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re licensed trademarks of Rogers
Corporation |
| (All techtips are offered in PDF format and require the use of Adobe Acrobat Reader to view) |
Techtip #1....................... |
Selecting Engineered Materials |
| Techtip #2...................... | The Effect of Material Selection on Heat Flow in Flexible Printed Circuits |
| Techtip #3...................... | Maximizing Flex Life in Flexible Printed Circuits |
| Techtip #4...................... | Determination of Adhesive Thickness in Flexible Printed Circuits |
| Techtip #5...................... | Troubleshooting Guide |
| Techtip #6...................... | R/flex® 1000 Circuit Materials Resistance to Brake Fluid |
| Techtip #7...................... | Determination of Flex Life in Flexible Printed Circuits |
| Techtip #8...................... | Measurement and Interpretation of Peel Strength |
| Techtip #9...................... | Measurement of Copper Thickness by the Weight Method |
| Techtip #10..................... | Dimensional Stability Measurement |
| Techtip #11..................... | Lamination and Heat Tacking R/flex 1000 Bonding Films |
| Techtip #12..................... | Punching Considerations |
| Techtip #13..................... | Surface Preparation of Copper-Clad Laminate |
| Techtip #14..................... | Tool Design Considerations for Polyimide-Based Materials |
| Techtip #15..................... | Punching of Polyimide Film: Material Deformation |
If you have questions please e-mail our Technical Service representative at techcmu@rogers-corp.com. We will be happy to assist you.
R/flex and LEAD/lock are licensed trademarks of Rogers Corporation |
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