Power amplifiers, controller boards and components are key elements to the overall function of base stations in today’s wireless communication networks. Electrical performance and high power management are often deciding factors in the selection of materials for these applications. RO3000® and RO4000® series materials have proven to have the properties needed by design engineers in developing more advanced systems while at the same time doing so in a cost effective way. Tight control of dielectric constant, low loss performance and above all high thermal conductivity are the features that have made these products the best choice in this market.

RO3000® High Frequency Materials : 
RO3003™, RO3035™, RO3006™, RO3010™, RO3203™, RO3206™, 3210™ 

Product Features:

  • Low dielectric loss for high frequency performance (RO3003). Laminate can be used in applications up to 30-40 GHz. 
  • Excellent mechanical properties versus temperature for reliable stripline and multilayer board constructions.
  • Uniform mechanical properties for a range of dielectric constants. Ideal for multilayer board designs with a range of dielectric constants. Suitable for use with epoxy glass multilayer board hybrid designs.
  • Stable dielectric constant versus temperature and frequency for RO3003 laminates. Ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.
  • Low in-plane expansion coefficient (matched to copper). Allows for more reliable surface mounted assemblies. Ideal for application sensitive temperature change and excellent dimensional stability.
  • Volume manufacturing process for economical laminate pricing.
 

 

Typical Applications: Automotive Collision Avoidance Systems, Automotive Global Positioning Satellite Antennas, Cellular and Pager Telecommunication Systems, Patch Antennas for Wireless Communications, Direct Broadcast Satellites, Datalink on Cable Systems, Remote Meter Readers, Power Backplanes


RO4000® Series Materials
RO4003C™, RO4350B™, RO4350i ™Laminates,  RO4403™, RO4450B™ Prepreg

Product Features:

  • Non-PTFE - Thermoset Resin System

  • Excellent high frequency performance due to low dielectric tolerance and loss

  • Stable electrical properties versus frequency

  • Low thermal coefficient of dielectric constant

  • Low Z-Axis expansion

  • Low in-plane expansion coefficient

  • Excellent dimensional stability

  • Volume manufacturing process for economical pricing.

Typical Applications: LNB's for Direct Broadcast Satellites, Cellular Base Station Antennas and Power Amplifiers, Spread Spectrum Communications Systems, RF Identifications Tags, Automated Test Equipment, High Speed Backplanes and Line Cards, High Frequency Automotive Electronics.

 


Rogers Corporation, 
Advanced Circuit  Materials Division 

High Frequency Laminates
100 S. Roosevelt Ave, Chandler, AZ 85226

Flexible Circuit Materials

100 N. Dobson Road, Chandler, AZ 85224 

Phone: 480 961-1382/ Fax: 480 961-4533/ Site Feedback


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RT/duroid, DUROID, TMM, ULTRALAM, R/flex, R/flex CRYSTAL, R/flex JADE, R/flex OPAL, R/flex PEARL, RO3000, RO3003, RO3035, RO3006, 

RO3010, RO3200, RO3203, RO3206, RO3210, RO4000, RO4003C, RO4350 are trademarks of Rogers Corporation.

 


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