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As speeds in the
network increase, so does the need for high performance materials.
Rogers offers a solution for your high-speed digital design needs for
applications like Internet infrastructure, servers, storage, and test
equipment RO4350B™ High Frequency Material is a core material that offers low dielectric constant (3.48 + .05) and low loss (.004). Low dielectric constant and low loss reduce cross- talk. The combination of these properties enables designers to reduce overall board thickness and increase circuit trace and space density. The material has excellent dielectric constant and thickness control (+ 10%) for sensitive controlled impedance applications. RO4350B laminate is a thermoset material suited for fabrication and assembly in high volume. Low z-axis CTE (50 ppmºC) provides excellent plated through hole reliability. High Tg (280ºC) along with high thermal conductivity (.62 W/m/ºK) allows RO4350B material to be used in a wide variety of operating environments and process conditions. RO4350B laminate is UL 94V-0 and offers a prepreg, RO4450B laminate, for a truly homogenous material system. Product Features:
Typical Applications: High speed backplanes and line cards. Device under test (DUT) boards and pin cards for automated test equipment. High layer count MLB's, Hybrid MLB's.
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