Rogers Corporation R/flex® flexible circuit materials are used in interconnecting devices and stand-alone devices. Flex circuits can be populated with electronic components like a PC board, with the benefit of flexible shapes and motion. Flex circuits offer superior electrical and mechanical performance compared to other interconnect devices such as ribbon cable and hard wire. 

Some Typical Applications: Hard Disk Drives, Notebook Computers, Cell Phones, Chip Scale Packaging, Print Head Cartridges, 2 Way Radio, Network Devices, CD-Rom, Optical Drives

 


R/flex® 1000 Laminates and Coverfilms 

  • Excellent Flexibility - for long life dynamic flexing ideally suited for disk drive applications
  • Excellent chemical resistance - for harsh end use environments
  • high modulus adhesive - for superior wire bondability

R/flex 1100 Laminates and Coverfilms 
  • Excellent chemical resistance and 150°C (300°F) UL® rated operating temperature - for harsh environment high temperature applications.
  • Excellent dimensional stability - for fine line tight tolerance circuit complexities.

R/flex 1500 Assembly Adhesive
  • Excellent adhesion to a variety of materials, giving improved performance in demanding applications
  • Resistant to many common solvents and other chemicals for greater process latitude
  • SPC manufacturing assures minimum variability and maximum lot-to-lot uniformity
  • Adhesive available in rolls.

 


R/flex 2001 Laminates and Coverfilms 
  • Meets IPC Class 3 requirements - Used in high reliability military and medical applications.
  • Transparent Adhesive System - Allows optical inspection.
  • High bond strength and excellent caustic resistance - for high process yields
  • Better drilled hole quality - for high reliability and better fabricator productivity.
  • Laminate available in continuous rolls - for efficient inventory control and flexible response to multiple process panel sizes.

R/flex 2005 Laminates and Coverfilms - was formulated in response to industry requirements for UL® listed materials. It has a flame rating of UL® 94 VTM-0- and a thermal index of 105°C. 

  • R/flex 2005 High bond strength
  • High process yields

  • Low moisture absorption

  • Increased yields and improved electrical performance


R/flex Crystal® 7200 Laminates and Coverfilms
  • Excellent ALL PURPOSE adhesive system - compatible with single sided through multilayer circuit constructions.
  • UL® VTM-0 TRANSPARENT flame retardant system - facilitates optically dependent fabrication and assembly operations. HIGH MOT 115°C (239°F) - allows more design-in.
  • Excellent dimensional stability - better yields/ results for fine line tight tolerance designs.
  • Improved coverfilm lamination process latitude - provide excellent control of adhesive squeeze out - higher process yields.
  • Excellent chemical, thermal and moisture properties - for ease of fabricaiton and design-in.

R/flex 8080 Liquid Photoimageable Covercoat
  • Eliminates coverfilm lamination, punching and drilling processes
  • Reduces tooling costs and lead time
  • Captures high density surface mount features
  • Excellent imaging resolution - ideally suited for ultra-fine line features for flexible circuitry
  • Excellent process stability and high pot life - for high yields in mass production
  • Excellent electrical, thermal and chemical properties - meets performance requirements of IPC Specification SM-840, Rev.C
  • Five formulation versions available - for optimal process and end use performance.

Rogers Corporation, 
Advanced Circuit  Materials Division 

High Frequency Laminates
100 S. Roosevelt Ave, Chandler, AZ 85226

Flexible Circuit Materials

100 N. Dobson Road, Chandler, AZ 85224 

Phone: 480 961-1382/ Fax: 480 961-4533/ Site Feedback


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RT/duroid, DUROID, TMM, ULTRALAM, R/flex, R/flex CRYSTAL, R/flex JADE, R/flex OPAL, R/flex PEARL,RO3000, RO3003, RO3035, RO3006, 

RO3010, RO3200, RO3203, RO3206, RO3210, RO4000, RO4003C, RO4350B are trademarks of Rogers Corporation.

 


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