About our Products - Laminates and Flexible Circuit Materials

RT/duroid® 5870/5880 glass microfiber reinforced PTFE composites.

The two products in this family are RT/duroid 5870 (er =2.33) and 5880 (er =2.2) materials. These are the oldest Rogers products and were developed as an alternative to PTFE/woven glass, with less anisotropy of  er , in the 1960’s. The dielectric constant is the lowest of all products and low dielectric loss make these materials best suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of their extremely low water absorption characteristics, RT/duroid 5870 and 5880 are ideal for applications in high moisture environments.

ULTRALAM® 2000 is the PTFE/woven glass

Ultralam 2000 materials are made with only 1080 glass for high reliability applications. 

RT/duroid® 6000 PTFE/Ceramic laminates

RT/duroid® 6002 (er =2.94), RT/duroid 6202  were developed to address several of the drawbacks of PTFE based materials. Introduced in the late 1980’s, this material’s unique properties are excellent dielectric constant thermal stability and a coefficient of thermal expansion matched to that off copper. This product is ideal for applications in thermal changing environments (space), multilayer constructions due to high reliability of plated through holes as well as in relatively high frequency applications because of its low dielectric loss.

Applications including flat and non--planar structures such as antennas and complex multilayer circuits with interlayer connections, are particularly suited to the unique properties of our RT/duroid 6202PR materials.

There are three grades of material from this product family, RT/duroid 6006 (er =6.15) and 6010LM (er =10.2) materials were developed in the late 1970’s to provide an option to designers wishing to reduce the size of the circuit boards. The high dielectric constant of these materials yields smaller signal wavelengths and the circuits can be made smaller.
3001 Bonding Film 
(Thermoplastic Chloro-fluorocopolymer)

3001 Bonding Film is recommended for bonding low dielectric constant PTFE  microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric.
TMM® Temperature Stable Microwave Laminates 
(Thermoset ceramic loaded plastic)

TMM substrates, TMM 3 (er =3.27), TMM 4 (er =4.5), TMM 6 (er =6.0), TMM 10 (er =9.2) and TMM 10i (er =9.8), combined the best of the ceramic and PTFE substrate world. Introduced in the early 1990’s, TMM materials provided a rigid substrate to which device attachment could be easily done, as well as providing a substrate that could be manufactured using conventional printed circuit board techniques unlike the expensive processing of pure thin film high purity alumina. Like the RT/duroid 6002 material, TMM thermal properties were well matched so as to have stable electrical and mechanical performance. With a wide variety of dielectric constants, these substrates can be used in space applications, particularly microstrip patch antennas.

 

 RO3000® and RO3200™ series High Frequency Laminates -
(PTFE/Ceramic) 

The first of a series of commercial products (early 1990’s), the RO3000®  materials family consists of three grades, RO3003™ (er =3.0), RO3035 (er r= 3.50), RO3006 (er =6.15) and RO3010 (er =10.2) laminate. These materials combine microwave frequency electrical properties and improved temperature stable performance at a fraction of the cost of it’s military grade counterparts (RT/duroid 6000 laminate). With a CTE matched to that of copper and FR4 in the X-Y plane, RO3000/FR4 hybrid constructions can be fabricated reliably. The RO3003 can be used at relatively high frequencies because of its low dielectric loss (tan d =0.0013 @ 10 GHz).

RO3200 laminate family is made up of RO3203 (er =3.02) and RO3210 (er =10.2) materials, developed for applications where RO3000 materials are suited but require a material with greater mechanical strength. RO3200 materials are made by combining PTFE/ceramic layers with PTFE/woven glass for added rigidity. Like RO3000 materials, this family is also suited for MLB’s and hybrid constructions with FR4.

RO4000® Series High Frequency Circuit Materials 
(Woven glass/ ceramic loaded thermoset plastic resin)

RO4000® High Frequency Circuit Materials were developed to provide high frequency performance comparable to woven glass PTFE substrates with the ease of fabrication associated with epoxy/glass laminates. RO4000 material is a woven glass reinforced/ceramic filled. thermoset material with a very high glass transition temperature (Tg >280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. Therefore, RO4000 material circuit processing and assembly costs are comparable to epoxy/glass laminates. RO4003C was designed with an er of 3.38. The RO4350B has a er of 3.48 and is UL94V-0 rated.

RO4450B™  and RO4450F prepregs were developed to enable users to build high frequency multilayer and are based upon the RO4000 series core materials and are compatible in multilayer constructions with either RO4003C, or RO4350B  laminates. RO4400 prepregs are compatible with the majority of standard FR4 processing practices.

RO4230 high frequency laminate extends the RO4000 product series into antenna applications.  The ceramic filled, glass reinforced hydrocarbon based material provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials

With a dielectric constant of 2.9, a loss tangent of 0.002 at 20 GHz and very low moisture absorption (<0.04% by weight), LCP laminates are suited for high frequency microminaturization applications, sensors, antennas and high speed flip-chip designs.

ULTRALAM® 3850 circuit material is a double-clad copper laminate, with the temperature resistant liquid crystalline polymer as a dielectric film, with a melt temperature of 315°C. 
R/flex Flexible Circuit Materials

R/flex® 1000 Laminates and Coverfilms - are Kapton® film based laminates with rolled annealed copper foil, and coversheets ideally suited for constructing single and double sided flexible circuitry. R/flex 1000 system has been used for more than 20 years in demanding dynamic flex design applications where millions of flex cycles are required, in semiconductor packaging in which low levels of ionic contamination are advantageous. and in tape automated bonding (TAB) applications.

  • Excellent Flexibility - for long life dynamic flexing ideally suited for disk drive applications
  • Excellent chemical resistance - for harsh end use environments
  • high modulus adhesive - for superior wire bondability
R/flex 1100 Laminates and Coverfilms - high performance flexible circuit material system is designed for use in harsh, high temperature environments. The system combines the desirable properties of a thermosetting phenolic butyral adhesive with rolled annealed copper and Upilex®-S polymide film, low in oxygen and moisture permeability. R/flex®1100 laminates are UL rated with continuous operating temperatures of 150°C (302°F). The material system exhibits low moisture absorption, good dimensional stability and excellent chemical resistance.
  • Excellent chemical resistance and 150°C (300°F) UL® rated operating temperature - for harsh environment high temperature applications.
  • Excellent dimensional stability - for fine line tight tolerance circuit complexities.
R/flex 1500 Assembly Adhesive - is an unsupported dry film adhesive especially designed to meet the demanding requirements of electronics assembly operations. It is widely used to affix stiffeners and for mounting hardware to polyimide-based flexible circuits. The modified acrylic adhesive is readily heat-tackable, crosslinks upon curing for tenacious bond to a variety of materials, and has excellent resistance to many common solvents and other chemicals.  It has excellent creep resistance, as well as outstanding bond retention after extended exposure to elevated temperature after exposure to 302°F (150°C) for more than ten days, peek strength remained greater than 10 pounds per linear inch (bond to polymide). For these reasons this versatile adhesive offers advantages in complex assembly applications.
  • Excellent adhesion to a variety of materials, giving improved performance in demanding applications
  • Resistant to many common solvents and other chemicals for greater process latitude
  • SPC manufacturing assures minimum variability and maximum lot-to-lot uniformity
  • Adhesive available in rolls
R/flex 2001 Laminates and Coverfilms - high performance circuit material system was formulated in response to industry requirements for high peel strength and IPC-FC-241 and 232/1 performance. The R/flex 2001 material system consisting of Kapton® film based laminate with rolled annealed copper foil, coversheet, and bonding film, offers wide process latitude, high bond strength and solvent resistance. Low moisture absorption and closely controlled adhesive thickness help to prove superior electrical performance in demanding applications.
  • Meets IPC Class 3 requirements - Used in high reliability military and medical applications.
  • Transparent Adhesive System - Allows optical inspection.
  • High bond strength and excellent caustic resistance - for high process yields
  • Better drilled hole quality - for high reliability and better fabricator productivity.
  • Laminate available in continuous rolls - for efficient inventory control and flexible resonse to multiple process panel sizes.
R/flex 2005 Laminates and Coverfilms - was formulated in response to industry requirements for UL® listed materials. It has a flame rating of UL® 94 VTM-0- and a thermal index of 105°C (221°F). The R/flex 2005 material system, consisting of Kapton® polymide film based laminates with rolled annealed copper foil, cover sheet, and bonding film offers wide process latitude, high bond strength and solvent resistance. Improved electrical performance is attained in critical applications with its low moisture absorption and closely controlled adhesive thickness.
  • R/flex 2005 High bond strength
  • High process yields
  • Low moisture absorption
  • Increased yields and improved electrical performance
R/flex CRYSTAL 7200 laminates and coverfilms - flexible circuit materials are film-based laminates, with roll annealed copper foil, and coversheets ideally suited for constructing single and double sided flexible circuitry. The R/flex crystal system has been introduced to meet the increasing performance and design demands imposed on today's flexible circuit materials. Inherent flame retardant performance superior adhesion, dynamic flexibility, low and predictable dimensional change, resistance to harsh processing chemicals, and the clarity of the adhesive for automated processing and assembly make this system ideal for meeting the challenges of high density circuitry in dynamic or static applications.
  • Excellent ALL PURPOSE adhesive system - compatible with single sided through multilayer circuit constructions.
  • UL® VTM-0 TRANSPARENT flame retardant system - facilitates optically dependent fabrication and assembly operations. HIGH MOT 115°C (239°F) - allows more design-in.
  • Excellent dimensional stability - better yields/ results for fine line tight tolerance designs.
  • Improved coverfilm lamination process latitude - provide excellent control of adhesive squeeze out - higher process yields.
  • Excellent chemical, thermal and moisture properties - for ease of fabrication and design-in.

R/flex CRYSTAL® 7500/ 7700 laminates and coverlayers . Flame retardant epoxy adhesive technology base on a new film used by Rogers Corporation. The copper clad laminates are offered with rolled annealed and electrodeposited copper foils well suited for constructing single and double sided flexible circuitry .This epoxy adhesive system is uniquely formulated to exhibit superior fill and flow characteristics, electrical properties, flexibility and good chemical resistance.

  • High flex life provides for improved long-term reliability in demanding dynamic flexing applications.
  • Superior peel strength, superb dimensional stability and outstanding flow control improved process yields and reduces fabrication costs.
  • Transparent, flame retardant adhesive provides a UL rated material that meets the needs of automated visual inspection and assembly processes.

R/flex JADE® series of flexible copper clad laminate material is the next generation of the industry leading R/flex CRYSTAL® epoxy product line. R/flex JADE halogen-free flame retardant flexible material was developed to allow our customers to meet the increasing environmental requirements imposed upon commercial applications worldwide without compromising the performance required in today's demanding flexible circuit designs.

R/flex JADE halogen-free epoxy system delivers:

  • Superior thermal stability to withstand multiple passes through lead-free soldering
  • Transparent adhesive system
  • Excellent dimensional stability for ease of processing.
  • Design options - available in bonding film, coverlayer and flexible, copper-clad laminate constructions
  • RoHS compliant, Halogen-free epoxy system
R/flex 8080 Liquid Photoimageable Covercoat - help achieve the ultra-fine patterns needed for today's high density flexible printed circuits. Offering uniform coverage and reliable performance in mass production processes, R/flex 8080 materials allow manufacturing of high precision patterns unattainable through conventional screen printing.
  • Eliminates coverfilm lamination, punching and drilling processes
  • Reduces tooling costs and lead time
  • Captures high density surface mount features
  • Excellent imaging resolution - ideally suited for ultra-fine line features for flexible circuitry
  • Excellent process stability and high pot life - for high yields in mass production
  • Excellent electrical, thermal and chemical properties - meets performance requirements of IPC Specification SM-840, Rev.C
  • Five formulation versions available - for optimal process and end use performance.
ADHESIVELESS FLEXIBLE CIRCUIT MATERIAL

LONGLITE 200  -  all-polyimide (adhesiveless) laminates. 

  • Enables design density.
  • Thinner cross-sections than laminates with adhesives, allowing for more design freedom in flexing applications.
  • No adhesive to remove from laser-cleared openings or plated through holes.
  • Improves assembly success with higher temperature operation and soldering.
  • Reduces a potential source of electromigration.
  • Improved flex life design.
  • LONGLITE 200 has been certified to meet the specifications of IPC 4204/11.

LONGLITE 300 Adhesiveless Series Flexible Copper Laminate Material Double-clad Laminate

  • Excellent dimensional stability, for use in making fine line flexible circuit designs and assemblies.
  •  Superior solder resistance, ideal for lead-free soldering temperatures.
  • Thinner cross-section than laminates with adhesives, allowing more design freedom in flexing assemblies.
  • Inherently flame-resistant, halogen-free (green) with flammability rating of UL 94VTM-0.

     

 

 

Kapton is a registered trademarks of DuPont de Nemours and Company
Upilex is a registered trademark of  Ube Corporation
Apical is a registered trademark of Kanegafuchi Chemical

Rogers Corporation, 
Advanced Circuit  Materials Division 

High Frequency Laminates
100 S. Roosevelt Ave, Chandler, AZ 85226

Flexible Circuit Materials

100 N. Dobson Road, Chandler, AZ 85224 

Phone: 480 961-1382/ Fax: 480 961-4533/ Site Feedback


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RT/duroid, DUROID, TMM, ULTRALAM, R/flex, R/flex CRYSTAL, R/flex JADE, R/flex OPAL, R/flex PEARL, RO3000, RO3003, RO3035, RO3006, 

RO3010, RO3200, RO3203, RO3206, RO3210, RO4000, RO4003C, RO4350 are trademarks of Rogers Corporation.

 

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