ULTRALAM® 3000 Series Liquid Crystalline Polymer (LCP) Circuit Material

Rogers Corporation, Advanced Circuit Materials Division, is offering a new family of products using a liquid crystalline polymer (LCP) as the dielectric material. These thin-film, flexible adhesiveless laminates were developed specifically for use as a core for single layer or to build up multi-layer constructions.

With a dielectric constant of 2.9, a loss tangent of 0.002 at 20 GHz and very low moisture absorption (<0.04% by weight), LCP laminates are suited for high frequency microminaturization applications, sensors, antennas and high speed flip-chip designs.

ULTRALAM 3850 circuit material is a double-clad copper laminate, with the temperature resistant liquid crystalline polymer as a dielectric film, with a melt temperature of 315°C.

Technical Literature:

Rogers Corporation, 
Advanced Circuit  Materials Division 

High Frequency Laminates
100 S. Roosevelt Ave, Chandler, AZ 85226

Flexible Circuit Materials

100 N. Dobson Road, Chandler, AZ 85224 

Phone: 480 961-1382/ Fax: 480 961-4533/ Site Feedback


Copyright ©2006 Rogers Corporation, All Rights Reserved -  

Disclaimer - Privacy Policy - Security Statement

 

RT/duroid, DUROID, TMM, ULTRALAM, R/flex, R/flex CRYSTAL, R/flex JADE, R/flex OPAL, R/flex PEARL, RO3000, RO3003, RO3035, RO3006, 

RO3010, RO3200, RO3203, RO3206, RO3210, RO4000, RO4003C, RO4350B are trademarks of Rogers Corporation.

 

ISO9001:2000 Certificate

The world runs better with Rogers.™